FDI Specification and Developer Tools made available

19 November 2013

The Fieldbus Foundation has announced the first public release of FDI Cooperation, LLC's Field Device Integration (FDI) specification and a demo of the FDI developer toolkits, which make it possible.

The FDI specification and the latest Electronic Device Description Language (EDDL) specifications were handed over to the International Electrotechnical Commission (IEC) for the next phase - the Committee Draft for Vote - in the international standardisation process. FDI will be included in the emerging standard IEC 62769.

The core of the FDI specification is the FDI Device Package which includes everything that a host system needs to integrate an intelligent device. With FDI, a single FDI Device Package that can scale according to the complexities and requirements of each device represents individual instruments.

Each FDI Device Package contains a Device Description (EDD), providing parameter definitions, structure for the parameters for context-specific views, and automated work processes for device procedures such as calibration. FDI Device Packages may also incorporate User Interface Plug-Ins, software components that support advanced device setup and diagnostic functions. Additionally, product manuals, documentation, images, electronic certifications and other attachments can be delivered in the FDI Device Package.

FDI Device Packages are designed to make it easier for automation suppliers to develop and integrate intelligent devices because they only need to create a single package for each intelligent device that can work with all host systems and tools, reducing overall development costs and expanding functionality. Users should also find it easier to manage information from intelligent devices with a single device package – there will be no need to juggle different technologies or invest in custom integration efforts to connect multiple technology platforms.