Molex Acquires Interconnect Systems, Inc. 22/04/2016
Molex, a global manufacturer of electronic solutions, have announced the acquisition of Interconnect Systems, Inc. (ISI) which specialises in the design and manufacture of high density silicon packaging with advanced interconnect technologies.
Cadalec scoops overseas project with PICS capability 29/04/2010
When tendering for a large overseas project UK based control system specialist, Cadalec noted that the specification required the application to be simulated using PICS software. Cadalec had recently upgraded its PICS software from HardwarePT, placing them in a comfortable position to deliver a project with high efficiency and reduced costs.
High density M12 connectors for industry’s harshest demands 14/11/2009
In harsh production environments, where IP67 protection class is required, circular connectors with their associated cordsets and receptacles are commonly used for signal transmission from the sensor device back to the control cabinet. For relatively simple sensors, M8 and M12 connectors with 3 to 5 poles are now considered the de facto standard.