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3D vision can identify lifted leads in PCB assembly

30 July 2018

The printed circuit board assembly process and soldering of electronic components will inevitably result in production errors, even as an automated process. 3D machine vision can be a useful tool to detect any defects.

The automatic optical inspection (AOI) has been established to detect flaws and 3D can also deliver new insights into that process.

With EyeVision 3D pins of ICs, THTs, SMDs or even BGAs can be inspected, and lifted leads or lifted pads can also be identified. Lifted leads are among the most critical errors and it most often occurs when trying to de-solder components from the board or due to reduced wetting, when a pin is oxidised. It has, traditionally, been a difficult fault to identify as many parameters determine the shape of a lifted lead and the solder joint.

The EyeVision 3D can also determine the wobble circle – if the pins are not exactly centered. The software can recognise if the pins are all at the same height, or are bent or if any there are standing out or are too deep in the body.

EyeVision can also identify whether the pins are resting correctly on the board after assembly.


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