This website uses cookies primarily for visitor analytics. Certain pages will ask you to fill in contact details to receive additional information. On these pages you have the option of having the site log your details for future visits. Indicating you want the site to remember your details will place a cookie on your device. To view our full cookie policy, please click here. You can also view it at any time by going to our Contact Us page.

TE Connectivity joins the OPC Foundation

25 September 2016

Connectivity and sensors company, TE Connectivity, has joined the OPC Foundation, a vendor-independent non-profit organisation which drives the development, maintenance and promotion of Openness Productivity Connectivity – Unified Architecture (OPC UA). 

This engagement is said to reflect TE’s commitment to the concepts of the Industrial Internet of Things (IIoT) and Industry 4.0, the key elements of which are semantic interoperability and transmission integrity, the essential aspects of OPC UA.

OPC UA is an industrial communication architecture for the secure, reliable, and semantic interoperability between sensors, field devices, controllers and applications at the shop-floor level (operational technology, OT) as well as between the OT and enterprise IT (cloud) systems. OPC UA is standardised within the IEC 62541 series. Additional companion standards detail the requirements for specific systems.

OPC UA is also used in the “Smart Manufacturing Connectivity for Brownfield Sensors – Sensor to the Cloud (SttC) Testbed”, a project carried out by TE together with SAP, ifm and the OPC Foundation under the umbrella of the Industrial Internet Consortium (IIC) to develop an experimentation platform with the objective of seamlessly integrating IO-Link sensors with IT systems in existing facilities. This project will also deliver essential input to an IO-Link/OPC UA Companion Standard that sensor manufacturers and connectivity providers are about to work on.

Contact Details and Archive...

Most Viewed Articles...

Print this page | E-mail this page